Quantum 3DHI Engineer (2027 New College Graduate)

What you'll do

• Drive 3DHI process development for wafer-to-wafer and die-to-wafer bonding projects.
• Collaborate with process engineers, tool suppliers, and outsourced assembly partners on integration processes.
• Develop expertise in materials, tooling, and characterization for semiconductor packaging.
• Analyze failure modes and improve yields while reducing cycle time and costs.

What they're looking for

• Bachelor's or Master's in Electrical, Mechanical, Chemical Engineering, or Materials Science.
• Prior internship or co-op experience in related field.
• Minimum 3.0 GPA and good academic standing.
• Fluent in English; willing to travel up to 10%.

Pay and perks

• $85,000–$146,000 annually, based on qualifications and experience.