Device Compact Modeling Engineer (2027 New College Graduate)
GlobalFoundriesAdded 3d ago
Austin, TXFull-timeEntry
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ProJev · full postingWhat you'll do
- Develop SPICE models for digital, analog, and RF devices in CMOS technologies
- Establish best practices for data selection, model extraction, validation, and circuit benchmarking
- Coordinate across device modeling, characterization, PDK, and design teams on projects
- Support customers with technical questions and compact model issue resolution
What they're looking for
- Bachelor's degree in Electrical Engineering, Physics, or related field; 3.0+ GPA
- Fundamental semiconductor device physics knowledge for compact modeling
- Understanding of device noise and matching behaviors
- Preferred: internship experience, Python/Perl coding, SPICE model generation experience
Pay and perks
- $58,400–$100,800 annually, based on qualifications and experience
- Mentorship, networking, and leadership development opportunities
Summarized by newgrad.ai from GlobalFoundries's public posting. Check the original for full details before you apply.
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